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| 05130 SFC05-5 Only One Name Means ProT ek'TionTM FLIP CHIP ARRA Y APPLICA TIONS Cellular Phones Personnal Digital Assistant (PDA) Ground Positioning System (GPS) SMART & PCMCIA Cards IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns 61000-4-5 (Surge): 24A, 8/20s - Level 2(Line-Gnd) & Level 3(Line-Line) FEA TURES ESD Protection > 25 kilovolts 250 Watts Peak Pulse Power per Line (tp = 8/20s) Protects up to Five(5) Unidirectional & Four (4) Bidirectional Lines MECHANICAL CHARACTERISTICS Weight 0.73 milligrams (Approximate) Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel Top Contacts: Solder Bump 0.004" in Height (Nominal) PENT A PIN CONFIGURA TION 6 5 4 1 2 BOTTOM VIEW 3 05130.R6 8/03 1 www.protekdevices.com SFC05-5 DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TJ TSTG VALUE 250 -55C to 150C -55C to 150C UNITS Watts C C ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 5A VC VOLTS 9.5 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE VWM VOLTS SFC05-5 5.0 @ 1mA V(BR) VOLTS 6.0 @8/20s VC @ IPP 11.0V @ 24A @VWM ID A 10 @0V, 1 MHz Cj pF 150 FIGURE 1 PEAK PULSE POWER VS PULSE TIME 10,000 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 120 100 80 60 40 20 0 tf FIGURE 2 PULSE WAVE FORM Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s 1,000 250W, 8/20s Waveform e-t 100 td = t I /2 PP 10 0.01 1 10 100 td - Pulse Duration - s 1,000 10,000 0 5 10 15 t - Time - s 20 25 30 05130.R6 8/03 2 www.protekdevices.com SFC05-5 GRAPHS FIGURE 3 POWER DERATING CURVE Peak Pulse Power 8/20s 225C 5-10 sec 60 200C Instantaneous to 200C 100 80 % Of Rated Power FIGURE 4 REFLOW SOLDER PROFILE 40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150 Pre-Heat Time Soldering Time Cool Down Time 100C 1-2 Minutes to 150C 1-2 Minutes to 25C Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material. FIGURE 5 OVERSHOOT & CLAMPING VOLTAGE FOR SFC05-5 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 6 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR SFC05-5 14 12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 05130.R6 8/03 3 www.protekdevices.com 15 20 VC - Clamping Voltage - Volts SFC05-5 PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE PACKAGE DIMENSIONS DIM A B C MILLIMETERS 0.510 0.510 0.99 0.0254 0.15 NOM 1.5 0.0254 0.15 NOM See Note 3 0.076 MIN I 0.419 NOM INCHES 0.020 0.020 0.039 0.001 0.006 NOM 0.059 0.001 0.006 NOM See Note 3 0.003 MIN 0.0165 NOM B SIDE C A E F G H TOP G E F H NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. "H" Dimensions for the SFC05-5 device are 0.10mm Max and 0.004" Max. END I MOUNTING PAD LA YOUT - Option 1 DIM A A B C D E F G NOTE: PAD DIMENSIONS MILLIMETERS 0.305 0.457 0.203 0.254 0.510 0.990 0.510 INCHES 0.012 0.018 0.008 0.010 0.020 0.039 0.020 DIE SOLDER BUMPS C F E 1. Preferred: Using 0.1mm (0.004") stencil. B G SOLDER PADS SOLDER PRINT 0.010" - 0.012" DIA. SOLDER MASK D Outline & Dimensions: Rev 1 - 1/03, 06038 05130.R6 8/03 4 www.protekdevices.com SFC05-5 PACKAGE OUTLINE & DIMENSIONS MOUNTING PAD LA YOUT - Option 2 PACKAGE DIMENSIONS DIM A MILLIMETERS 1.5 NOM 0.152 NOM 0.510 0.990 0.510 INCHES 0.059 0.006 NOM 0.020 0.039 0.020 A COPPER CONTACTS 0.009" [0.23] DIA. B C D E DIE SOLDER BUMPS NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Preferred: Using 0.1mm (0.004") stencil. Outline & Dimensions: Rev 0 - 10/02, 06039 D C E T APE & REEL ORIENT TION A B 1 6 5 4 SOLDER PRINT 0.014" [0.36] DIA. SOLDER MASK 2 3 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., SFC05-5-T75-1). 3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., SFC05-5-T75-2). COPYRIGHT (c) ProTek Devices 2003 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05130.R6 8/03 5 www.protekdevices.com |
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